PlateLoc . Technical Specifications
PERFORMANCE
Cycle Time: Approximately 8 seconds per plate
Heat Up Time: 2.5 minutes
Cool Down Time:1 hour (from 160 °C to room temperature)
Sealing Temperature: 30 to 200 °C
LABWARE COMPATIBILITY
Microplates:Standard microplates including PCR plates, deep-well plates and standard plates in 96, 384 and 1536-well formats.
Microplate Material Types: Seals are compatible with polypropylene and polystyrene plates.
OPERATING REQUIREMENTS
Electrical: North America 120 VAC, 50-60 Hz, AC Current 6A/115V (typical), Inrush Current 20A/115V (typical); Europe 220 VAC, 50-60 Hz, AC
Current 3A/230V (typical),
Inrush Current: 40A/230V (typical)
Air:70 Lpm at 6.2 bar (2.5 cfm at 90 psi)
Software: PlateLoc Diagnostics for real-time, manual control (setup/troubleshooting)
BenchWorks™ or VWorks™ for use with a Velocity11 lab automation system
PlateLoc AcitveX Commands when using 3rd party software to control the PlateLoc Controller
Not required for manual operation; PC using Windows 2000 or XP operating system for higher throughput applications when part of a lab
automation system
Interface:RS-232 serial port with DB 9 connector
Certification: CE certified
SEAL MATERIALS
Velocity11 offers a variety of plate sealing materials covering a wide range of sealing applications. See the PlateLoc Thermal Seal
Selection Guides (below) for the latest choices in seal material, part numbers, information on seal properties and applications.
Download Aluminum Seal Selection Guide, 23K
Download Clear Seal Selection Guide, 21K
PERIPHERAL INSTRUMENT COMPATIBILITY
Automated Plate Sealing: For high throughput sealing needs, the PlateLoc can be integrated with the Vleocity11 BenchCel microplate handling
system. The BenchCel allows up to 320 plates to be sealed at one time, at a rate of 3 plates per minute, making quick work of even the
tallest rack of plates.
Other Velocity11 Instruments: Bravo™ automated liquid handling platform, VPrep® pipetting system, VCode® bar code print and apply station,
VSpin™ with Access2™ integrated microplate centrifuge (all of these require the use of an automated plate handler/robot for integration).
Third Party Instruments:Compatible with some reagent dispensers, plate shakers, plate readers, sealers, washers. compound reformatters,
plate storage systems, etc. when used with an automated plate handler/robot for integration and appropriate compatible software.
DIMENSIONS
Dimensions of Base Unit (HxWxD): 58.4 x 21.6 x 39.9 cm (23" x 8.5" x 15.7")
Weight: 20 kg (45 lbs)
PlateLoc Aluminium & Clear Seal Selection Guide >
Request for PlateLoc Technical/Applications Support (PDF) >
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New:
Gas-Purging PlateLoc Thermal Sealer
for Compound Storage Applications
See the description below for details or contact your
sales representative for ordering information.
Gas-Purging PlateLoc Description
The Gas-Purging PlateLoc uses inert gas, such as Argon, to displace air, containing moisture and oxygen, in the plate
immediately before the sealing begins. The plate contents can be protected from hydration and oxidation for up to 24 hours. Typically used
for compound storage applications, the Gas-Purging PlateLoc is best for plate contents that are sensitive to oxidation and moisture (for
example, DMSO).
Note: For typical polystyrene and polypropylene plates, the gas-purging effects can last up to 24 hours when the plates are stored at
room temperature. The effects can last longer if the plates are stored at lower temperatures.
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